Field Service Engineer
Duties and Responsibilities Install and qualify ASMPT's Proprietary Semiconductor Equipment for high precision interconnection technology for IC Packaging Analyze, interpret and make critical decision on process and equipment related issues.
Interface with customers to ensure issues are addressed on a timely manner.
Provide technical training at customers facility.
Support machine Installation and Qualification (IQ) activities as defined by our customers.
Perform other duties as assigned.
Understanding customer requirements to ensure system meets requirements and generate new business opportunities.
Submits on time reports required.
Education and Experience RequirementsBachelor's Degree in Materials, Mechanics, Chemistry, Physics or Microelectronics with a minimum of 1 - 2 years' experience in IC Packaging and Assembly related equipmentNote:
Only candidates with a bachelor's degree as a minimum or AS Degree with a minimum 4-year Semiconductor Microelectronics or Automation experience will be consideredOther Requirements Must be willing to travel up to 60% of the time.
Travel includes both International and Domestic Legally authorized to work in the US.
Must be able to work with minimal supervision.
Good written and oral communication and interpersonal skills Strong analytical background is a definite asset.
Microsoft Office Suite competency preferred.
Knowledge and experience in Laser beam delivery system or wafer dicing is a plus.
Recommended Skills Analytical Automation Communication Industrial Laser Tasking Interpersonal Skills Mechanical Engineering Apply to this job.
Think you're the perfect candidate? Apply on company site Estimated Salary: $20 to $28 per hour based on qualifications.
Interface with customers to ensure issues are addressed on a timely manner.
Provide technical training at customers facility.
Support machine Installation and Qualification (IQ) activities as defined by our customers.
Perform other duties as assigned.
Understanding customer requirements to ensure system meets requirements and generate new business opportunities.
Submits on time reports required.
Education and Experience RequirementsBachelor's Degree in Materials, Mechanics, Chemistry, Physics or Microelectronics with a minimum of 1 - 2 years' experience in IC Packaging and Assembly related equipmentNote:
Only candidates with a bachelor's degree as a minimum or AS Degree with a minimum 4-year Semiconductor Microelectronics or Automation experience will be consideredOther Requirements Must be willing to travel up to 60% of the time.
Travel includes both International and Domestic Legally authorized to work in the US.
Must be able to work with minimal supervision.
Good written and oral communication and interpersonal skills Strong analytical background is a definite asset.
Microsoft Office Suite competency preferred.
Knowledge and experience in Laser beam delivery system or wafer dicing is a plus.
Recommended Skills Analytical Automation Communication Industrial Laser Tasking Interpersonal Skills Mechanical Engineering Apply to this job.
Think you're the perfect candidate? Apply on company site Estimated Salary: $20 to $28 per hour based on qualifications.
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